TMSC vs Intel Advanced Nodes: The extreme demand for N2 from both mobile and AI, N3 oversubscription, N5 lingering demand, and outlook for A16/A14 from mobile and HPC. Intel 18A demand, and uncertain future of 14A.
Advanced Packaging Dynamics: CoWoS shortage and increasing demand, TSMC repurposing facilities, rise of alternative advanced packaging solutions, and Intel EMIB as a diamond in the rough.
Server CPU demand for Agentic AI: Intel’s $11B CPU fumble, AMD silicon fungibility, and Intel’s questionable architecture choices.